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The strip configuration at left is a closed cellsponge configuration with periodic vertical conductive silver traces which can be positioned at various integrals along the strip width with an exposed conductive pad on both top and bottom strip surfaces. Excellent for I/O panels with die-cut openings (Custom die cuts available.)


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Item #
Item #
Unit of Measure
English Metric
Part Number
Conductive Outer Layer Material
Core Material Color
Durometer
Mounting Tape or Clip
Packaging
Length
Dimension H
Dimension W
Dimensional Specifications